The IEEE WIE International Scholarship is an annual award funded through the IEEE Foundation Women in Engineering Fund and administered by IEEE Women in Engineering. It supports one eligible full-time undergraduate worldwide who has completed two years of engineering study.
The selection materials assess academic performance and the applicant’s reasons for entering engineering and receiving the scholarship. Applications are currently closed, and IEEE has not published the next application window.
Benefits & funding
- One recipient receives a certificate.
- One recipient receives a one-time monetary prize of US$2,500.
Eligibility
- Be an IEEE WIE Student Member in at least the second consecutive year of WIE membership.
- Be enrolled full time as an undergraduate and have completed two years in an engineering curriculum at an accredited university or college.
- Provide evidence of at least a 3.7 GPA on a 4.0 scale or the local equivalent.
- Applicants worldwide may apply; the current criteria state no nationality or residency restriction.
- The current criteria state no gender restriction, and IEEE WIE membership is open regardless of gender or background.
- Self-nominations and nominations by others are accepted; an applicant may apply more than once but may receive the scholarship only once.
Can you apply?
Here's who can apply
Decoded from the official rules. A free account checks them against your passport, degree and age in seconds.
Education required
Bachelor Enrolled
Gender requirement
Female
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Application process
- 1Wait for IEEE WIE to announce a new submission window on the official program page.
- 2Enter the IEEE Awards and Nominations Portal from the official page and sign in with an IEEE account.
- 3Prepare a 1,000-word essay on entering the engineering profession and a 500-word essay explaining why the applicant should receive the scholarship.
- 4Arrange one academic recommendation, one personal recommendation, and evidence of the required GPA.
- 5Submit the complete application before the announced deadline.
Program timeline
The most recently published application cycle opened.
Sep 23, 2024
The most recently published application deadline.
Nov 4, 2024
Current status
Submissions are closed; the next cycle dates have not been published.